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Surface Pro 7+ for Business Component Disassembly and Reassembly

Warning

Review the General Safety Precautions and Battery Safety guidelines in their entirety before proceeding with any repair steps.

Important

Read this Guide in its entirety before starting any repairs. If at any point you're unsure or uncomfortable about performing the repairs, as detailed in this Guide, DO NOT proceed. Contact Microsoft for more support options.

Warning

Failure to follow the instructions in this Guide, use of non-Microsoft (nongenuine), incompatible, or modified replacement parts, and/or failure to use proper tools could result in serious injury, death, and/or damage to the product or other property.

Prerequisite Steps

Steps outlined in this section should be conducted before starting any repair on a Surface device.

  • Power off device – Ensure the device is powered off completely and the battery has been fully discharged. Refer to the Repair-specific precautions and warnings section for guidelines. Once discharged, the device should be disconnected from all power sources.

  • ESD Prevention – Ensure ESD prevention steps and general guidelines are followed before opening the device. Refer to the ESD Prevention section for guidelines.

  • Position Device – To prevent damage to the device, ensure the device is placed on a clean surface free of debris.

Kickstand Replacement Process

Preliminary Requirements

Important

Be sure to follow all special (bolded) notes of caution within each process section.

Required Tools and Components

Prerequisite Steps

  • Power off device – Ensure device is powered off and disconnected from a power supply.
  • General Safety – Check to make sure that general guidelines and ESD compliance steps are followed before opening device. Refer to Prior to Device Disassembly section for details.

Procedure - Removal (Kickstand)

  1. Place device screen-down on soft ESD safe mat. Ensure mat is clear of any abrasive material that might scratch the Touch Display Module (TDM) glass.

  2. Extend the kickstand to approximately 90 degrees.

    Screenshot that shows the kickstand extended to roughly 90 degrees on a Surface Pro 7+.

  3. Remove hinge screws – Using the 3IP (Torx-Plus) driver, loosen all four hinge screws by 2-3 rotations. With the screws loose, use your finger to hold the back of the kickstand behind each hinge while fully removing the two hinge screws. Ensure screws don't fall into the hinge opening.

    Screenshot that shows removal of the kickstand hinge screws with a 3IP Torx-Plus driver.

  4. Lay Kickstand Down – Lay the kickstand flat against the IBC. Be careful not to jostle the kickstand in this position as it might cause abrasions on the IBC.

    Screenshot that shows the kickstand laid flat against the IBC before hinge compression.

  5. Angle hinges Down – Using your thumb or index finger, push both hinges down from 90 degrees to approximately 30 degrees. This requires a great deal of force. If necessary, place the microfiber cloth between your finger and the hinge for comfort. Be careful not to push the hinge all the way into the bucket as it is difficult to pull back out.

    Screenshot that shows both hinges pushed down to approximately 30 degrees during removal.

  6. Remove Kickstand – Using the palm of your hand, firmly hold the device down from the center of the IBC. Simultaneously, grip the kickstand off-center between your thumb and index finger and firmly pull. Pull with a moderate amount of force until the foam inserts slide out of the device. If the kickstand is stuck, ensure it isn't caught on the hinges.

    Screenshot that shows the kickstand being pulled away as foam tabs slide out of the device.

Procedure - Installation (Kickstand)

Screenshot that shows the new replacement kickstand assembly positioned for installation.

Important

Use caution when handling new kickstand assembly to avoid cosmetic damage of the kickstand and the device.

  1. Insert Foam Tabs – With the hinges still at ~30 degrees start to slide the new kickstand’s foam tabs into the slots on the back of the IBC. Foam should slide in with minimal force—don't crumple the foam by using excess force.

Caution

Don't use any tool or sharp object to assist inserting the tabs into the slots. Only the tabs should be inserted. Doing so could damage to internal components.

Screenshot that shows foam tabs on the new kickstand aligned with the rear slot openings

  1. Lay Kickstand Down – Lay the kickstand flat against the IBC. Be careful not to jostle the kickstand in this position as it might cause abrasions on the IBC.

    Screenshot that shows the replacement kickstand laid flat against the IBC before hinging up

  2. Angle hinges Up – Using your thumb or index finger, push both hinges up from 30 degrees to approximately 90 degrees. This requires a great deal of force. If necessary, place the microfiber cloth between your finger and the hinge for comfort.

    Screenshot that shows the hinges lifted back to approximately 90 degrees during reinstallation.

  3. Install hinge screws – Flip the kickstand up to approximately 90 degrees such that the threaded holes of the kickstand align with the mounting holes of the hinge. Install the hinge screws in the order shown with the 3IP (Torx-Plus) driver. Ensure screws don't fall into the hinge opening. Use your finger to hold the back of the kickstand behind the hinge while installing the screws until they're fully seated. Verify the kickstand is properly aligned and seated in the hinges, then tighten the screws an more ~quarter turn (~90 degrees).

    Screenshot that shows the correct order for reinstalling hinge screws with the kickstand raised

    Screenshot that shows a close-up of hinge screw alignment holes on the kickstand

  4. Final inspection Kickstand installation – Fold down the kickstand and peel off protective plastic from the kickstand and logo if present. Verify the side edges of the kickstand are aligned with the midframe walls and that there are no obvious steps/gaps between the kickstand and the IBC. Wipe the device thoroughly (including under the kickstand) with the microfiber cloth to remove all fingerprints.

rSSD Replacement Process

Preliminary Requirements

Screenshot that shows the underside area highlighting the removable rSSD door.

Important

Be sure to follow all special (bolded) notes of caution within in each process section.

Required Tools and Components

  • Tools:
    • 3IP (Torx-Plus) driver
    • Anti-static wrist strap (1M Ohm resistance)
    • Soft ESD safe mat
    • Microfiber / Lint free cloth
    • SIM eject tool (or equivalent 0.58 mm / 0.023 in diameter paperclip)
  • Components:

Prerequisite Steps:

  • Power off device - Ensure device is powered off and disconnected from a power supply.
  • General Safety - Check to make sure that general guidelines and ESD compliance steps are followed before opening device. Refer to Prior to Device Disassembly section for details.

Procedure - Removal (rSSD)

  1. Remove rSSD door – Use SIM eject tool.

    Screenshot that shows using a SIM eject tool to open the rSSD door.

  2. Remove rSSD 3IP Screw – Use a 3IP (Torx-Plus) driver to remove the screw securing the rSSD.

    Screenshot that shows a 3IP Torx-Plus driver removing the rSSD retention screw.

  3. Remove rSSD – The rSSD should lift upwards to ~15-degree tilt after screw is removed. Carefully grab sides of rSSD case and pull out of main board socket at same ~15-degree angle.

    Screenshot that shows the rSSD lifted at about a 15-degree angle for extraction.

Procedure - Installation (rSSD)

Important

Only a Microsoft rSSD of like capacity should be replaced in the device.

  1. Insert rSSD – Insert the connector end of the rSSD into the rSSD connector on Main board at ~15-degree angle.

    Screenshot that shows the rSSD being inserted connector-first at a 15-degree angle.

  2. Install new rSSD 3IP screw – Use a 3IP screwdriver to install a new rSSD screw until the screw is snug and seated, and then turned another 45 degrees (1/8 turn) or until screw is fully fastened.

    Screenshot that shows tightening the new rSSD screw until properly seated.

  3. Replace rSSD door.

    Screenshot that shows the rSSD door closed and fully reinstalled.

  4. Imaging – Image the new rSSD by using a BMR Imaging USB drive specific to the device model.

Important

Refer to Surface imaging process - Surface Imaging Tools

  1. Run SDT – Run SDT to ensure all device features and functions operate as expected.

Swap rSSD to a new device process

Preliminary Requirements

Important

Be sure to follow all special (bolded) notes of caution within each process section. The rSSD 3IP screw is reused in this process. Only a Microsoft rSSD of like capacity should be replaced in the device.

Required Tools and Components

  • Tools:
    • 3IP (Torx-Plus) driver
    • Anti-static wrist strap (1M Ohm resistance)
    • Soft ESD safe mat
    • Microfiber / Lint free cloth
    • SIM eject tool (or equivalent 0.58 mm / 0.023 in diameter paperclip)
    • USB Drive
    • Surface Dock
    • Wired Ethernet connection to the Internet
    • USB keyboard
  • Components:
    • New SIM/rSSD door if necessary. (Refer to Illustrated Service Parts List)

Prerequisite Steps:

  • Using an Internet connection, install all available updates: Navigate to Settings > Update & Security and check for Windows Update.
  • Consumer using Windows Home:
    • The BitLocker recovery key is automatically generated for users with an MSA and can be found by the user by searching the web for “BitLocker recovery key” and logging into their MSA. If the user doesn't have an MSA based account, the disk won't be encrypted.
  • Commercial using Windows Pro:
    • This is managed via commercial policy, and each business might have their own BitLocker policy / recovery method.
    • Confirm that the customer knows the Windows password to the device.
  • General Safety – Check to make sure that general guidelines and ESD compliance steps are followed before opening device. Refer to Prior to Device Disassembly section for details.

Procedure - Swap (rSSD)

  1. Manage BitLocker

    1. If rSSD remains encrypted during swap
      1. Navigate to BitLocker >Manage BitLocker >Generate BitLocker Recovery Key
      2. Plug in USB drive.
      3. Save the recovery key to USB storage.
      4. Remove the USB drive.
    2. If rSSD can be unencrypted before swap:
      1. Navigate to BitLocker >Manage BitLocker
      2. Select Turn Off BitLocker
  2. Shut down customer’s old device and remove SIM/rSSD door remove SIM/rSSD door on new device – Use SIM eject tool.

    Screenshot that shows SIM/rSSD door removal on both devices using the eject tool.

  3. Remove SIM (if present in customer’s old device).

    Screenshot that shows the SIM card being removed from the original device.

  4. Remove rSSD 3IP Screw from both devices – Use a 3IP (Torx-Plus) driver to remove the screw securing the rSSD. Take care not to damage the screw; it will be reused.

    Screenshot that shows rSSD retention screws being removed from both devices.

  5. Remove rSSD from both devices – The rSSD should lift upwards to ~15-degree tilt after screw is removed. Carefully grab sides of rSSD case and pull out of main board socket at same ~15-degree angle.

    Screenshot that shows both rSSD modules lifted at a ~15-degree angle for removal.

  6. Insert rSSD – Insert the connector end of the rSSD into the rSSD connector on Main board at ~15-degree angle. Place the rSSD removed from the new device into the customer’s original device. Place the customer’s original rSSD into the new device.

    Screenshot that shows the swapped rSSD being inserted into the new device at a 15-degree angle.

  7. Install rSSD 3IP screw in both devices – Use a 3IP screwdriver to install the rSSD screw until it's snug and seated, and then turn another 45 degrees (1/8 turn) or until screw is fully fastened.

    Screenshot that shows tightening of the rSSD screw after the swap.

  8. Install SIM (if present from the customer’s old device in the new device).

    Screenshot that shows reinserting the SIM card into the new device.

  9. Replace rSSD door on both devices.

    Screenshot that shows both devices with SIM/rSSD doors replaced.

  10. Plug new device into power and wired Internet connection.

  11. Power on new device – The device might go through a firmware update during startup.

  12. If the SSD remained encrypted during the swap:

    1. Plug in USB drive with BitLocker recovery key.
    2. Open the .txt file with the BitLocker recovery key.
    3. Manually enter the recovery key into the new device.
  13. Connect a keyboard to the new device.

  14. Navigate to Sign-In Options->Password (key icon on the left side).

  15. Customer enters Windows password. Select “Sign In”.

  16. Customer might need to go through two-factor authentication.

  17. Once fully signed in, navigate to Start->Account->Sign Out

  18. Customer signs in with Windows password again.

  19. Customer prompted to set up Windows Hello and PIN.

    1. If the device was previously Bitlockered, navigate to BitLocker >Manage BitLocker >Resume BitLocker
  20. Run SDT – Run SDT to ensure all device features and functions operate as expected.

  21. Check Windows activation – Navigate to Settings >Activation. If there's any error message, select Troubleshoot.

  22. Check Office Account – Open Office app and then navigate to File > Account and check for any error messages.

  23. Check cellular (if SIM present) – Unplug device from wired network and disable Wi-Fi. Check that cellular network shows connected, and that the device can open a webpage.

  24. Return customer’s original device per established procedures.

TDM Replacement Process

Preliminary Requirements

Important

Be sure to follow all special (bolded) notes of caution within each process section.

Required Tools and Components

  • Tools:
    • 3IP (Torx-Plus) driver
    • Anti-static wrist strap (1M Ohm resistance)
    • Soft ESD safe mat
    • Microfiber / lint free cloth
    • SIM eject tool (or equivalent 0.58 mm / 0.023 in diameter paperclip)
    • Isopropyl alcohol dispenser bottle (use 91% or greater IPA)
    • Cotton swab
    • USB drive with Surface Diagnostic Toolkit
    • Spudger
    • iFixit pick
    • Metric ruler
    • TDM PSA bonding frame
    • Foam Pad (Material: EVA Foam, Thickness: 9.5 mm, Density: 0.03 g/cm3, Minimum 229 mm x 305 mm) (Recommended McMaster PN: 86095K43)
    • TDM bonding weights minimum 32 kg (70 lb) / maximum 35 kg (77 lb) (Recommended using three Ruck weights two 9 kg, one 14 kg) (Alternate Steel Shot Bags two 9 kg, one 14 kg)
  • Components:

Prerequisite Steps:

  • Prep Device – Device must be set in TDM Replacement Mode prior to removing TDM.
  1. Connect software tools USB drive with SDT to USB connector on device under repair.

  2. Connect power supply to device.

  3. Power on device – Depress the power button on the side of the device.

  4. Run software tool – At the device OS, use Windows Explorer, navigate to USB drive and run:

    SDT – Select Repair setup and validation. Run the Touch Display Setup. At the end of the tool process device will power down.

Warning

This step must be carried out on the device successfully before the TDM is replaced.

  • Power off device – Ensure device is powered off and disconnected from a power supply. Remove all attached cables and drives.
  • General Safety – Check to make sure that general guidelines and ESD compliance steps are followed before opening device. Refer to Prior to Device Disassembly section for details.
  • Remove rSSD – Remove the rSSD as detailed in the Procedure – Removal (rSSD).

Procedure - Removal (TDM)

  1. Debonding TDM Marking Pick Depth – Using a metric ruler draw an 8-mm mark on the iFixit pick.

    Screenshot that shows an 8 mm depth mark drawn on an iFixit pick using a metric ruler.

  2. Debonding TDM – Place the device face up on a Soft ESD safe mat. Replace the iFixit pick if all the tips look scratched or deformed. Securing the device with one hand insert one of the iFixit pick tips into the right speaker area. Carefully cut the PSA applying a steady force along all edges of the TDM. Limit the pick depth to 8 mm. Run the pick 2 times around all edges of the TDM.

    Screenshot that shows the iFixit pick cutting adhesive along the TDM edge with limited depth.

Caution

Don't insert the pick more than 8mm along the edge of the TDM.

  1. Separate TDM From IBC – Gently pull up vertically on the top edge of the glass while pushing down on the IBC with your thumbs to separate the glass. Lift the edges of the TDM and inspect for any remaining PSA. Slice or remove (with an iFixit Pick) any strands still connecting the TDM to the IBC.

    Screenshot that shows lifting the top edge of the TDM glass away from the IBC.

  2. Disconnect TDM FPCs – While supporting the TDM with one hand, remove the shield lid on the TDM FPC by inserting pointed end of a spudger underneath the inner edge the of the shield. Then gently pull upwards and the shield will come off. Disconnect the TDM FPCs using the pointed end of a spudger. Don't pull on the FPCs to disconnect.

    Screenshot that shows removal of the shield and exposure of TDM FPC connectors.

  3. Remove Residual IBC PSA – Using flat side of a spudger, IPA, and cotton swabs, clean residual PSA off the IBC. Use only IPA and cotton swabs to clean the top edge. Ensure area around the Camera and IR Sensor is clean and free of any dust or other contamination. Wipe the area around the camera with a lint free cloth.

    Screenshot that shows cleaning residual PSA from the IBC using a spudger and cotton swabs.

  4. Speaker Mesh – Inspect speaker mesh for any signs of damage. Remove damaged speaker mesh from the IBC. Insert a pick between the Speaker mesh and the enclosure. Remove any residual adhesive using IPA and cotton swabs.

    Screenshot that shows inspecting and removing damaged speaker mesh from the enclosure.

  5. Inspect for Antenna Deck (LTE Only) – After removing the TDM on LTE devices, inspect the antenna deck gold traces. The passing criterion is shown. Devices with damaged traces require whole unit exchange.

    Screenshot that shows acceptable antenna deck gold trace condition on an LTE device

Procedure - Installation (TDM)

  1. Pre-installation Device Inspection

Warning

Verify the battery’s condition refer to the M1153910 In Device Battery Inspection process. Devices exhibiting battery issues as outlined in the Battery Inspection Process require whole unit replacement.

Important

Leave protective cling on new TDM during all installation steps.

Important

Carefully inspect the internal areas of the bucket. Ensure the area around battery is free of any foreign objects.

  1. Speaker Mesh Application (as required) – Wipe down the outer edges of the speaker mesh region on the bucket with a cloth to remove any residue or debris before application of new mesh. Remove the protective liner from the speaker mesh. Align the speaker mesh into the corresponding bucket opening. Press onto the mesh for 10 seconds to activate the adhesive. Carefully remove the clear handle. Repeat this process for the other side of the bucket.

    Screenshot that shows aligning new speaker mesh in the bucket opening before adhesion.

  2. TDM PSA Application – Thoroughly clean the IBC along the TDM PSA bonding surface using IPA and a cotton swab. Wait at least 30 seconds before applying new PSA. Apply the 4 strips of PSA to the IBC. Align the PSA following the outline on the IBC. Leave the blue liner on the PSA, it is removed at a later step. Refer to the illustration for PSA locations.

    Diagram of TDM PSA strip placement along the IBC bonding surface.

  3. Connect TDM FPCs – While supporting the TDM with one hand, connect the TDM FPCs by pressing them into the mainboard. Install a new shield over the TDM FPCs. Ensure all edges of the shield are snapped into place.

    Screenshot that shows pressing TDM FPCs into the mainboard and installing a new shield.

  4. Apply TDM to Bucket – Hover the TDM and remove the PSA Liners to expose adhesive. Align the TDM along the bottom edge first (Toe-in) and lower after alignment is found. Ensure that the glass sits flush in the IBC and doesn't rest anywhere on top of the IBC lip.

    Screenshot that shows aligning the TDM bottom edge (toe-in) before lowering into place

  5. Bonding PSA – Bonding is a two-step process. Refer to the illustrations.

Important

Weight Requirement: Minimum 32 kg (70 lb) / Maximum 35 kg (77 lb) Minimum Dimensions: 280mm x 200mm Geometry must be symmetrical, to allow for even weight distribution. Weight used must be a flat plate, with consistent flatness and not protrude from contact plane with Bonding Frame. Weight must contact the full perimeter of the frame when placed above it. Recommended weights (Ruck Plates of 9 kg + 9 kg + 14 kg) hen using Ruck weights place the 14-kg weight 1st the stack the two 9 kg of weight on top.

Diagram of bonding frame and weight placement for PSA compression.

  1. After Bonding Inspection – Remove the weights, foam pad, and the frame. Lift carefully to avoid damaging the device. Inspect the TDM for scratches, cracks, large gaps, and its flushness with respect to the IBC.

  2. Install rSSD – Install the rSSD as detailed in the Procedure – Installation (rSSD).

  3. TDM Calibration – Device final calibration relies on the successful completion of the TDM Replacement Mode.

    1. Connect software tools USB drive with SDT to USB connector on device under repair.
    2. Power on device – Depress the power button on the side of the device.
    3. Run software tool – At the device OS, use Windows Explorer, navigate to USB drive and run:

    SDT – Select Repair setup and validation. Run the Touch Display Calibration. Accept the restart prompt at the end of the tool process.

Warning

This step must be carried out on the device successfully. Any tool failures require restarting the TDM replacement process with a new FRU.

  1. Run SDT – Run all SDT tests to ensure all device features and functions operate as expected.
  2. Final inspection TDM installation – Remove protective cling from the TDM. Verify the side edges of the TDM are flush, and that there are no obvious steps/gaps between the TDM and the IBC. Wipe the device thoroughly (including under the kickstand) with the microfiber cloth to remove all fingerprints.

Procedure - Alternate Installation (TDM)

  1. Preinstallation Device Inspection

Warning

Verify the battery’s condition refer to the M1153910 In Device Battery Inspection process. Devices exhibiting battery issues as outlined in the Battery Inspection Process require whole unit replacement.

Important

Leave protective cling on new TDM during all installation steps.

Important

Carefully inspect the internal areas of the bucket. Ensure the area around battery is free of any foreign objects.

  1. Speaker Mesh Application (as required) – Wipe down the outer edges of the speaker mesh region on the bucket with a cloth to remove any residue or debris before application of new mesh. Remove the protective liner from the speaker mesh. Align the speaker mesh into the corresponding bucket opening. Press onto the mesh for 10 seconds to activate the adhesive. Carefully remove the clear handle. Repeat this process for the other side of the bucket.

    Screenshot that shows speaker mesh alignment during alternate installation.

  2. TDM PSA Application – Thoroughly clean the IBC along the TDM PSA bonding surface using IPA and a cotton swab. Wait at least 30 seconds before applying new PSA. Apply the 4 strips of PSA to the IBC. Align the PSA following the outline on the IBC. Leave the blue liner on the PSA, it is removed at a later step. Refer to the illustration for PSA locations.

    Diagram of PSA strip locations for alternate TDM installation.

  3. Connect TDM FPCs – While supporting the TDM with one hand, connect the TDM FPCs by pressing them into the mainboard. Install a new shield over the TDM FPCs. Ensure all edges of the shield are snapped into place.

    Screenshot that shows TDM FPCs connected with the shield snapped into place.

  4. Apply TDM to Bucket – Hover the TDM and remove the PSA Liners to expose adhesive. Align the TDM along the bottom edge first (Toe-in) and lower after alignment is found. Ensure that the glass sits flush in the IBC and doesn't rest anywhere on top of the IBC lip. Lightly press on the edges of the TDM to create an initial bond.

    Screenshot that shows initial edge press creating a provisional bond after alignment.

  5. Alternate Bonding PSA – Bonding is a multi-step process. Refer to the illustrations.

Important

Use steel shot bags two 9 kg and one 14 kg. Apply the 1st 9-kg bag, then the 14-kg bag, and then the 2nd 9-kg bag.

Diagram of sequential steel shot bag placement during alternate bonding.

Continued on next page.

Diagram of bonding sequence continuation showing placement order of weights and frame.

  1. After Bonding Inspection – Remove the steel shot bags and lift device out of the frame. Lift carefully to avoid damaging the device. Inspect the TDM for scratches, cracks, large gaps, and its flushness with respect to the IBC.
  2. Install rSSD – Install the rSSD as detailed in the Procedure – Installation (rSSD)
  3. TDM Calibration – Device final calibration relies on the successful completion of the TDM Replacement Mode.
    1. Connect software tools USB drive with SDT to USB connector on device under repair.

    2. Power on device – Depress the power button on the side of the device.

    3. Run software tool – At the device OS, use Windows Explorer, navigate to USB drive and run:

      SDT – Select Repair setup and validation. Run the Touch Display Calibration. Accept the restart prompt at the end of the tool process.

Warning

This step must be carried out on the device successfully. Any tool failures require restarting the TDM replacement process with a new FRU.

  1. Run SDT – Run all SDT tests to ensure all device features and functions operate as expected.
  2. Final inspection TDM installation – Remove protective cling from the TDM. Verify the side edges of the TDM are flush, and that there are no obvious steps/gaps between the TDM and the IBC. Wipe the device thoroughly (including under the kickstand) with the microfiber cloth to remove all fingerprints.