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Surface Pro 8 Component Disassembly and Reassembly

Warning

Review the General Safety Precautions and Battery Safety guidelines in their entirety before proceeding with any repair steps.

Important

Read this Guide in its entirety before starting any repairs. If at any point you're unsure or uncomfortable about performing the repairs, as detailed in this Guide, DO NOT proceed. Contact Microsoft for more support options.

Warning

Failure to follow the instructions in this Guide, use of non-Microsoft (nongenuine), incompatible, or modified replacement parts, and/or failure to use proper tools could result in serious injury, death, and/or damage to the product or other property.

Prerequisite Steps

Steps outlined in this section should be conducted before starting any repair on a Surface device.

  • Power off device – Ensure the device is powered off completely and the battery has been fully discharged. Refer to the Repair-specific precautions and warnings section for guidelines. Once discharged, the device should be disconnected from all power sources.

  • ESD Prevention – Ensure ESD prevention steps and general guidelines are followed before opening the device. Refer to the ESD Prevention section for guidelines.

  • Position Device – To prevent damage to the device, ensure the device is placed on a clean surface free of debris.

rSSD Replacement Process

Preliminary Requirements

Important

Be sure to follow all special (bolded) notes of caution within each process section.

Required Tools and Components

  • Tools:
    • 3IP (Torx-Plus) driver
    • Anti-static wrist strap (1M Ohm resistance)
    • Soft ESD safe mat
    • Microfiber / Lint free cloth
    • SIM eject tool (or equivalent 0.023 in / 0.58-mm diameter paperclip)
  • Components:

Prerequisite Steps

  • Power off device – Ensure device is powered off and disconnected from a power supply.
  • General Safety – Check to make sure that general guidelines and ESD compliance steps are followed before opening device. Refer to Prior to Device Disassembly for details.

Procedure - Removal (rSSD)

  1. Remove rSSD door – Use SIM ejector tool.

    Screenshot that shows using a SIM eject tool to open the Surface Pro 8 rSSD/SIM door.

  2. Remove rSSD screw – Use a 3IP (Torx-Plus) driver to remove the screw securing the rSSD.

    Screenshot that shows removing the single rSSD retention screw with a 3IP Torx-Plus driver.

  3. Remove rSSD – The rSSD should lift upwards to ~15-degree tilt after screw is removed. Carefully grab sides of rSSD case and pull out of main board socket at same ~15-degree angle.

    Screenshot that shows lifting the rSSD at a fifteen-degree angle before sliding it out of the main board socket.

Procedure - Installation (rSSD)

Important

Only a Microsoft rSSD of like capacity should be replaced in the device.

  1. Insert rSSD – Insert the connector end of the rSSD into the rSSD connector on Main board at ~15-degree angle.

    Screenshot that shows inserting the replacement rSSD connector end at a fifteen-degree angle into its socket.

  2. Install new rSSD screw – Use a 3IP (Torx-Plus) driver to install a new rSSD screw until the screw is snug and seated, and then turn another 45 degrees (1/8 turn) or until screw is fully fastened.

    Screenshot that shows tightening the new rSSD screw until snug then an additional forty-five-degree turn.

  3. Replace rSSD door.

    Screenshot that shows replacing and closing the rSSD/SIM door after installation.

  4. Imaging – Image the new rSSD by using a BMR Imaging USB drive specific to the device model.

    Important

    Refer to Surface imaging process – Surface Imaging Tools

  5. Run SDT – Run SDT to ensure all device features and functions operate as expected.

Swap rSSD to a new device process

Preliminary Requirements

Important

Be sure to follow all special (bolded) notes, cautions, & warnings in each process section. The rSSD 3IP screw is reused in this process. Only a Microsoft rSSD of like capacity should be replaced in the device.

Required Tools and Components

  • Tools:

    • 3IP (Torx-Plus) driver
    • Anti-static wrist strap (1M Ohm resistance)
    • Soft ESD safe mat
    • Microfiber / Lint free cloth
    • SIM eject tool (or equivalent 0.023 in / 0.58-mm diameter paperclip)
    • USB Drive
    • Surface Dock
    • Wired Ethernet connection to the Internet
    • USB keyboard
  • Components:

Prerequisite Steps

  • Using an Internet connection install all available updates: Navigate to Settings-> Update and Security and check for Windows Update.

  • Consumer using Windows Home:

    • The BitLocker recovery key is automatically generated for users with an MSA and can be found by the user by searching the web for “BitLocker recovery key” and logging into their MSA. If the user doesn't have an MSA based account, the disk won't be encrypted.
  • Commercial using Windows Pro:

    • This is managed via commercial policy, and each business might have their own BitLocker policy / recovery method.
    • Confirm that the customer knows the Windows password to the device.
  • General Safety – Check to make sure that general guidelines and ESD compliance steps are followed before opening device. Refer to Prior to Device Disassembly for details.

Procedure – Swap (rSSD)

  1. Manage Bitlocker

    1. If rSSD remains encrypted during swap
      1. Navigate to Bitlocker >Manage Bitlocker >Generate Bitlocker Recovery Key.
      2. Plug in USB drive.
      3. Save the recovery key to USB storage.
      4. Remove the USB drive.
    2. If rSSD can be unencrypted before swap
      1. Navigate to Bitlocker >Manage Bitlocker.
      2. Select Turn Off Bitlocker.
  2. Shut down customer’s old device and remove SIM/rSSD door on new device – Use SIM ejector tool.

    Screenshot that shows removing the SIM/rSSD door on both devices during swap preparation.

  3. Remove SIM (if present in customer’s old device) – Push edge of SIM card to release from device.

    Screenshot that shows ejecting and removing the SIM card from the customer’s original device.

  4. Remove rSSD screw from both devices – Use a 3IP (Torx-Plus) driver to remove the screw securing the rSSD. Take care not to damage the screw; it will be reused.

    Screenshot that shows removing rSSD screws from both devices with a 3IP Torx-Plus driver.

  5. Remove rSSD from both devices – The rSSD should lift upwards to ~15-degree tilt after screw is removed. Carefully grab sides of rSSD case and pull out of main board socket at same ~15-degree angle.

    Screenshot that shows lifting each rSSD at a fifteen-degree angle prior to swapping between devices.

  6. rSSD Swap – Insert rSSD removed from the new device into customer’s original device, then insert customer’s original rSSD into new device. Insert the connector end of the rSSD into the rSSD connector on Main board at ~15-degree angle.

    Screenshot that shows inserting the customer’s original rSSD into the new device at 15 degrees.

  7. Install rSSD screws in both devices – Use a 3IP (Torx-Plus) driver to install the rSSD screw until it's snug and seated, and then turn another 45 degrees (1/8 turn) or until screw is fully fastened.

    Screenshot that shows reinstalling rSSD screws in both devices until snug then 45 degrees more.

  8. Install SIM (if present from the customer’s old device in the new device).

    Screenshot that shows inserting the SIM card into the new device after rSSD swap.

  9. Replace SIM/rSSD door on both devices.

    Screenshot that shows closing the SIM/rSSD doors on both devices post-swap.

  10. Plug new device into power and wired Internet connection.

  11. Power on new device. The device might go through a firmware update during startup.

  12. If the SSD remained encrypted during the swap:

    1. Plug in USB drive with BitLocker recovery key.
    2. Open the .txt file with the BitLocker recovery key.
    3. Manually enter the recovery key into the new device.
  13. Connect a keyboard to the new device.

  14. Navigate to Sign-In Options->Password (key icon on the left side).

  15. Customer enters Windows password. Select “Sign In”.

  16. Customer might need to go through two-factor authentication.

  17. Once fully signed in, navigate to Start->Account->Sign Out.

  18. Customer signs in with Windows password again.

  19. Customer prompted to setup Windows Hello and PIN.

    1. If the device was previously Bitlockered, navigate to Bitlocker >Manage Bitlocker >Resume Bitlocker.
  20. Run SDT – Run SDT to ensure all device features and functions operate as expected.

  21. Check Windows activation – Navigate to Settings >Activation. If there's any error message, select Troubleshoot.

  22. Check Office Account – Open Office app and then navigate to File > Account and check for any error messages.

  23. Check cellular (if SIM present) – Unplug device from wired network and disable WiFi. Check that cellular network shows connected, and that the device can open a webpage.

  24. Return customer’s original device per established procedures.

Kickstand Replacement Process

Preliminary Requirements

Important

Be sure to follow all special (bolded) notes of caution within each process section.

Required Tools and Components

  • Tools:

    • 3IP (Torx-Plus) driver
    • Loctite SF 7649
    • Loctite 243
    • Soft ESD safe mat
    • Microfiber cloth
  • Components:

Prerequisite Steps

  • Power off device – Ensure device is powered off and disconnected from a power supply.
  • General Safety – Check to make sure that general guidelines and ESD compliance steps are followed before opening device. Refer to Prior to Device Disassembly for details. for details.

Procedure - Removal (Kickstand)

  1. Place device screen-down on soft ESD-safe mat. Ensure mat is clear of any abrasive material that might scratch the Touch Display Module (TDM) glass.

  2. Extend the kickstand to approximately 90 degrees.

    Screenshot that shows the kickstand extended to 90 degrees before hinge screw removal.

  3. Remove hinge screws – Use your finger to hold the back of the kickstand behind the hinge while removing the hinge screws. One screw for each hinge. Ensure screws don't fall into the hinge opening.

    Screenshot that shows removing a single hinge screw while supporting the kickstand from behind.

  4. Angle Kickstand Down – Firmly grip the hinges and the kickstand between thumb and index fingers. Rotate the kickstand from 90 degrees to approximately 45 degrees.

    Screenshot that shows rotating the kickstand downward from ninety to forty-five degrees.

  5. Release Kickstand Threaded Bosses – Using fingers on the underside of the kickstand and thumb on the topside, slightly rotate the kickstand about the axis as shown. The kickstand should rotate ~5 degrees to free the two threaded bosses of the kickstand from the recesses of the hinges.

    Screenshot that shows rotating the kickstand to free its threaded bosses from hinge recesses.

  6. Remove Kickstand – Using the palm of your hand, firmly hold the device down from the center of the IBC. Simultaneously, grip the kickstand off-center between your thumb and index finger and firmly pull. Pull with a moderate amount of force until the foam inserts slide out of the device. If the kickstand is stuck, ensure the threaded bosses haven't slipped back into the recess on the hinges.

    Screenshot that shows pulling the kickstand away to remove foam inserts from chassis slots.

    Warning

    Inspect Removed Kickstand Foam Tabs – Damaged foam or tabs can't be safely removed. Attempts to do so can damage internal components. Don't insert anything other than the tabs into the slots. Ensure both tabs are complete and show no signs of tearing. If tabs show signs of tearing, part of the foam might still be inside the device. Before proceeding, all foam must be removed from the device. Foam left inside will require whole unit exchange.

    Diagram of acceptable and unacceptable kickstand foam tab conditions after removal.

Procedure - Installation (Kickstand)

Important

Use caution when handling new kickstand assembly to avoid cosmetic damage of the kickstand and the device.

  1. Insert Foam Tabs – With the hinges still at ~45 degrees start to slide the new kickstand’s foam tabs into the slots on the back of the IBC. Foam should slide in with minimal force—don't crumple the foam by using excess force. Don't slide the foams completely into the device—insert the foam tabs until ~3/4 of the foam tabs are inside the device.

    Caution

    Don't use any tool or sharp object to assist inserting the tabs into the slots. Only the tabs should be inserted. Doing so could damage internal components.

    Screenshot that shows inserting new kickstand foam tabs three quarters deep with hinges at 45 degrees.

  2. Slot Outer Lip of Hinge into Kickstand – Using fingers on the underside of the kickstand and thumb on the topside, slightly rotate the kickstand about the axis as shown. The kickstand should rotate ~5 degrees to catch the outer lip of the hinge. Push the kickstand toward the device.

    Screenshot that shows rotating the kickstand to catch the outer hinge lip before pushing inward.

  3. Slip Kickstand Threaded Bosses into Hinge Recesses – Maintaining pressure on the kickstand to prevent it from backing out, rotate the kickstand down into place (Figure 7-9). The threaded bosses of the kickstand should slip into the recesses of the hinges.

    Screenshot that shows slipping threaded bosses into hinge recesses while maintaining inward pressure.

  4. Rotate the Kickstand Up – Firmly grip the hinges and the kickstand between thumb and index fingers as shown. Rotate the kickstand from 45 degrees to approximately 90 degrees.

    Screenshot that shows rotating the kickstand upward from forty-five to ninety degrees to seat hinges.

  5. Apply thread locker to screws – Brush new screws with Loctite SF 7649 Activator. Let screws sit for 2 minutes after activator is applied before assembling to device.

    Screenshot that shows applying Loctite SF 7649 activator to new hinge screws prior to install.

  6. Apply thread locker to screws bosses – Apply one drop of Loctite 243 thread locker to each screw boss.

    Screenshot that shows applying a single drop of Loctite 243 thread locker to each screw boss.

  7. Install hinge screws – Use your finger to hold the back of the kickstand behind the hinge while installing the screws until they're fully seated. Ensure the kickstand is properly aligned and seated in the hinges, then tighten the screws another ~quarter turn (~90 degrees). Be careful to tighten the screws only until snug and not to strip the kickstand threads. Ensure screws don't fall into hinge opening.

    Screenshot that shows tightening hinge screws a quarter turn after seating while supporting kickstand.

  8. Final inspection Kickstand installation – Fold down the kickstand and peel off protective plastic from the kickstand and logo if present. Verify the side edges of the kickstand are aligned with the midframe walls and that there are no obvious steps/gaps between the kickstand and the IBC. Wipe the device thoroughly (including under the kickstand) with the microfiber cloth to remove all fingerprints.

TDM Replacement Process

Preliminary Requirements

Important

Be sure to follow all special (bolded) notes of caution within each process section.

Required Tools and Components

  • Tools:

    • 3IP (Torx-Plus) driver
    • Anti-static wrist strap (1M Ohm resistance)
    • Soft ESD safe mat
    • Microfiber / lint free cloth
    • SIM eject tool (or equivalent 0.023 in / 0.58-mm diameter paperclip)
    • Isopropyl alcohol dispenser bottle (use 91% or greater IPA)
    • Cotton swab
    • USB drive with Surface Diagnostic Toolkit
    • Spudger
    • iFixit opening tool
    • Plastic opening pick
    • Two 2 in spring clamps
    • TDM PSA debonding tool (M1214770-001)
    • TDM PSA bonding frame (M1178722-001)
    • Foam Pad (Material: EVA Foam, Thickness: 9.5 mm, Density: 0.03 g/cm3, Minimum 229 mm x 305 mm) (Recommended McMaster PN: 86095K43)
    • TDM bonding weights 23 kg (Recommended using two Ruck weights one 9kg, one 14 kg) (Alternate using steel shot bags one 9 kg, one 14 kg)
  • Components:

Prerequisite Steps

  • Prep Device – Device must be set in TDM Replacement Mode before removing a faulty TDM.
  1. Connect software tools USB drive with SDT to USB connector on device under repair.

  2. Connect power supply to device.

  3. Power on device – Depress the power button on the side of the device.

  4. Run software tool – At the device OS, use Windows Explorer, navigate to USB drive and run:

    SDT – Select Repair setup and validation. Run the Touch Display Setup. At the end of the tool process device powers down.

    Important

    This step must be carried out on the device successfully before removal of a faulty TDM. Ensure light levels in the work area remain consistent during the touch display setup process.

    • Power off device – Ensure device is powered off and disconnected from a power supply. Remove all attached cables and drives.
    • General Safety – Check to make sure that general guidelines and ESD compliance steps are followed before opening device. Refer to Prior to Device Disassembly for details.
    • Remove rSSD – Remove the rSSD as detailed in the Procedure–Removal (rSSD)

Procedure - Removal (TDM)

  1. Speaker Mesh Preparation – Place the device face up on a Soft ESD safe mat. Use an iFixit opening tool to widen the gap between the right speaker mesh and device. Push the sharp edge into the gap and side to side along the device edge. Once the flat tip fits fully in the gap, use it to push the speaker mesh towards the device, repeating uniformly along the length of the speaker mesh. The metal mesh will either fold lengthwise or slide completely under the glass. Repeat this process for left speaker mesh.

    Screenshot that shows folding speaker mesh beneath the glass with an iFixit opening tool.

  2. Debonding TDM Marking Pick Depth – Using a metric ruler draw a 2-mm mark and 8-mm mark on the plastic pick.

    Screenshot that shows metric ruler marking two and eight-millimeter depths on a plastic pick.

  3. TDM Debonding Tool

    1. Install marked pick in the holder with the marks in view. Use a 3 mm Allen Driver to adjust pick height to the lowest setting.

      Screenshot that shows installing the marked pick into the debonding tool holder at lowest height.

    2. Clamp debonding tool to edge of workbench. Ensure the cut depth adjustment can be accessed while the tool is clamped down.

      Screenshot that shows clamping the debonding tool to the workbench with depth adjuster accessible.

    3. Place the right side speaker edge of the device in the debonding tool above the pick. Adjust the pick height to the 2-mm mark. Ensure it enters the gap between the TDM and bucket edge.

      Screenshot that shows positioning the device so the pick enters the right side gap at 2 millimeters.

    4. With both hands, draw the right side of the device through the debonding tool track.

      Screenshot that shows drawing the right edge through the debonding track with both hands.

    5. At the bottom right corner, rotate the device in the debonding tool track. Draw the bottom side of the device through the debonding tool track.

      Screenshot that shows rotating at the bottom right corner then continuing along the bottom edge.

    6. At the bottom left corner, rotate the device in the debonding tool track. Draw the left side of the device through the debonding tool track.

      Screenshot that shows rotating at bottom left to draw the left edge through the debonding track.

    7. At the top left corner, rotate the device in the debonding tool track. Draw the top side of the device through the debonding tool track.

      Screenshot that shows rotating at top left to draw the top edge through the debonding track.

    8. Place the top left edge of the device in the debonding tool track. Adjust the pick height to the 8-mm mark. Ensure it enters the gap between the TDM and bucket edge. With both hands, draw the top edge of the device through the debonding tool track.

      Screenshot that shows increasing pick height to eight millimeters for top edge pass.

      Caution

      Don't insert the pick more than 2 mm along the left and right sides or bottom edge of the TDM. The pick depth shouldn't exceed 8 mm along the top edge of the TDM.

      Screenshot that shows caution depth diagram indicating 2 millimeter side/bottom and eight-millimeter top limits.

  4. Separate TDM from IBC – Gently pull up vertically on the top edge of the glass while pushing down on the IBC to separate the glass. Lift the edges of the TDM and inspect for any remaining PSA. Slice or remove (with an iFixit Pick) any strands still connecting the TDM to the IBC.

    Screenshot that shows lifting the top edge of the glass while pressing down on the IBC to separate TDM.

  5. Disconnect TDM FPC – While supporting the TDM with one hand, remove the shield lid on the TDM FPC by inserting pointed end of a spudger underneath the inner edge of the shield. Then gently pull upwards and the shield will come off. Disconnect the TDM FPC using the pointed end of a spudger. Don't pull on the FPC to disconnect.

    Screenshot that shows removing the shield lid and disconnecting the TDM FPC with a pointed spudger.

  6. Remove Speaker Mesh from IBC – Remove any remaining speaker mesh from the IBC. Use a handheld pick to remove it by inserting the pick between the Speaker mesh and the enclosure. Confirm a successful removal of the speaker mesh and its adhesive by verifying the three cutouts of the IBC are exposed, as shown.

    Screenshot that shows exposing three IBC cutouts after speaker mesh and adhesive removal.

  7. Remove Residual IBC PSA – Using IPA and cotton swabs clean residual PSA off the IBC. Ensure area around the Camera and IR Sensor is clean and free of any dust or other contamination. Wipe the area around the camera with a lint free cloth.

    Screenshot that shows cleaning residual PSA from IBC edges with IPA and cotton swabs.

Procedure - Installation (TDM)

  1. Pre-installation Device Inspection

    Warning

    Verify the battery’s condition refer to the M1153910 In Device Battery Inspection process. Devices exhibiting battery issues as outlined in the Battery Inspection Process require whole unit replacement.

    Important

    Leave protective cling on new TDM during all installation steps.

    Important

    Carefully inspect the internal areas of the bucket. Ensure the area around battery is free of any foreign objects.

  2. TDM PSA Application – Thoroughly clean the IBC along the TDM PSA bonding surface using IPA and a cotton swab. Wait at least 30 seconds before applying new PSA. Apply the 4 strips of PSA to the IBC. Align the PSA following the outline on the IBC. Leave the blue liner on the PSA, it is removed at a later step. Refer to the illustration for PSA locations.

    Screenshot that shows four new PSA strips applied along the IBC bonding outline leaving blue liners.

  3. Speaker Mesh Application – Place the TDM face-down on a Soft ESD safe mat. Wipe down the outer edges of the TDM with a lint free cloth. When installing the originally removed TDM ensure outer edges are clean and clear of PSA residue. Remove the protective liner from the speaker mesh. Using the clear handle, align the speaker mesh into the TDM speaker opening. Press onto the mesh for 10 seconds to activate the adhesive. Carefully remove the clear handle. Repeat this process for the other side of the TDM.

    Screenshot that shows aligning speaker mesh in TDM opening using clear handle before pressing for adhesion.

  4. Connect TDM FPC – While supporting the TDM with one hand, connect the TDM FPCs by pressing it into the mating connector on the reverse side of the TDM. Install a new shield over the TDM FPC. Ensure all edges of the shield are snapped into place

    Screenshot that shows pressing shield over connected TDM FPC ensuring all edges snap in place.

  5. Apply TDM to Bucket – Hover the TDM and remove the PSA Liners to expose adhesive. Turn over the TDM and place it on the IBC. Align the TDM along the top edge first (Toe-in) and lower after alignment is found. Ensure that the glass sits flush in the IBC and doesn't rest anywhere on top of the IBC lip.

    Screenshot that shows lowering aligned TDM onto IBC after removing PSA liners toe-in first.

  6. Bonding PSA – Place the bonding frame on the device, ensuring that the cutouts on the sides line up with the volume/power buttons. Place foam pad over bonding frame. Place the 23 kg of weight on top of the foam pad and bonding fame. Leave weight in place for 1 minute.

    Important

    Weight Requirement: Minimum 23 kg (50 lb) / Maximum 26 kg (57 lb) Minimum Dimensions: 280 mm x 200 mm

    Geometry must be symmetrical, to allow for even weight distribution. Weight used must be a flat plate, with consistent flatness and not protrude from contact plane with Bonding Frame.

    Weight must contact the full perimeter of the frame when placed above it. Recommended weights (Ruck Plates of 9 kg + 14 kg)

    When using Ruck weights place the 14-kg weight first, then stack the 9-kg weight on top. Ensure foam pad covers entire bonding frame.

    Diagram of bonding frame, foam pad, and stacked weights applying pressure for one minute.

  7. After Bonding Inspection – Remove the weights, foam pad, and the frame. Lift carefully to avoid damaging the device. Inspect the TDM for scratches, cracks, large gaps, and its flushness with respect to the IBC.

  8. Install rSSD – Install the rSSD as detailed in the Procedure - Installation (rSSD).

  9. New TDM Calibration – On installation of a new TDM device final calibration relies on the successful completion of the TDM Replacement Mode. TDM calibration isn't required when installing the originally removed TDM.

    1. Connect software tools USB drive with SDT to USB connector on device under repair.

    2. Power on device – Depress the power button on the side of the device.

    3. Run software tool – At the device OS, use Windows Explorer, navigate to USB drive and run:

      SDT – Select Repair setup and validation. Run the Touch Display Calibration. Accept the restart prompt at the end of the tool process.

    Important

    This step must be carried out on the device successfully on installation of a new TDM. Ensure light levels in the work area remain consistent during the touch display calibration process. Any tool failures require restarting the process with a new TDM.

  10. Run SDT – Run SDT to ensure all device features and functions operate as expected.

  11. Final inspection TDM installation – Remove protective cling from the new TDM. Verify the side edges of the TDM are flush, and that there are no obvious steps/gaps between the TDM and the IBC. Wipe the device thoroughly (including under the kickstand) with the microfiber cloth to remove all fingerprints.

Procedure – Alternate Installation (TDM)

  1. Pre-installation Device Inspection

    Warning

    Verify the battery’s condition refer to the M1153910 In Device Battery Inspection process. Devices exhibiting battery issues as outlined in the Battery Inspection Process require whole unit replacement.

    Important

    Leave protective cling on new TDM during all installation steps.

    Important

    Carefully inspect the internal areas of the bucket. Ensure the area around battery is free of any foreign objects.

  2. TDM PSA Application – Thoroughly clean the IBC along the TDM PSA bonding surface using IPA and a cotton swab. Wait at least 30 seconds before applying new PSA. Apply the 4 strips of PSA to the IBC. Align the PSA following the outline on the IBC. Leave the blue liner on the PSA, it is removed at a later step. Refer to the illustration for PSA locations.

    Screenshot that shows alternate method PSA strips aligned on IBC outline prior to speaker mesh application.

  3. Speaker Mesh Application – Place the TDM face-down on a Soft ESD safe mat. Wipe down the outer edges of the TDM with a lint free cloth. When installing the originally removed TDM ensure outer edges are clean and clear of PSA residue. Remove the protective liner from the speaker mesh. Using the clear handle, align the speaker mesh into the TDM speaker opening. Press onto the mesh for 10 seconds to activate the adhesive. Carefully remove the clear handle. Repeat this process for the other side of the TDM.

    Screenshot that shows alternate installation aligning speaker mesh with clear handle before adhesion.

  4. Connect TDM FPC – TBD While supporting the TDM with one hand, connect the TDM FPCs by pressing it into the mating connector on the reverse side of the TDM. Install a new shield over the TDM FPC. Ensure all edges of the shield are snapped into place.

    Screenshot that shows alternate installation pressing shield over TDM FPC connector.

  5. Apply TDM to Bucket – Hover the TDM and remove the PSA Liners to expose adhesive. Turn over the TDM and place it on the IBC. Align the TDM along the top edge first (Toe-in) and lower after alignment is found. Ensure that the glass sits flush in the IBC and doesn't rest anywhere on top of the IBC lip. Lightly press on the edges of the TDM to create an initial bond.

    Screenshot that shows alternate method lowering TDM onto IBC toe-in first after liner removal.

  6. Alternate Bonding PSA – Bonding is a multi-step process. Refer to the illustrations.

    Important

    Use steel shot bags, one 9 kg, and one 14 kg. Apply the 9-kg bag, and then the 14-kg bag.

    Diagram of two stacked shot bags applying nine and fourteen kilogram weights for alternate bonding.

  7. After Bonding Inspection – Remove the steel shot bags and lift device out of the frame. Lift carefully to avoid damaging the device. Inspect the TDM for scratches, cracks, large gaps, and its flushness with respect to the IBC.

  8. Install rSSD – Install the rSSD as detailed in the Procedure - Installation (rSSD).

  9. New TDM Calibration – On installation of a new TDM device final calibration relies on the successful completion of the TDM Replacement Mode. TDM calibration isn't required when installing the originally removed TDM.

    1. Connect software tools USB drive with SDT to USB connector on device under repair.

    2. Power on device – Depress the power button on the side of the device.

    3. Run software tool – At the device OS, use Windows Explorer, navigate to USB drive and run:

      SDT – Select Repair setup and validation. Run the Touch Display Calibration. Accept the restart prompt at the end of the tool process.

    Important

    This step must be carried out on the device successfully on installation of a new TDM. Ensure light levels in the work area remain consistent during the touch display calibration process. Any tool failures require restarting the process with a new TDM.

  10. Run SDT – Run SDT to ensure all device features and functions operate as expected.

  11. Final inspection TDM installation – Remove protective cling from the TDM. Verify the side edges of the TDM are flush, and that there are no obvious steps/gaps between the TDM and the IBC. Wipe the device thoroughly (including under the kickstand) with the microfiber cloth to remove all fingerprints.

THM Replacement Process

Preliminary Requirements

Important

Be sure to follow all special (bolded) notes, cautions, & warnings in each process section.

Required Tools and Components

  • Tools:

    • 3IP (Torx-Plus) driver
    • Anti-static wrist strap (1M Ohm resistance)
    • Soft ESD safe mat
    • SIM eject tool (or equivalent 0.023 in / 0.58-mm diameter paperclip)
    • Isopropyl alcohol dispenser bottle (use 91% or greater IPA)
    • Cotton swab
    • USB drive with Surface Diagnostic Toolkit
    • Spudger
    • iFixit opening tool
    • Plastic tweezers
    • TDM PSA debonding tool (M1214770-001)
    • TDM PSA bonding frame (M1178722-001)
    • Foam Pad (Material: EVA Foam, Thickness: 9.5 mm, Density: 0.03 g/cm3, Minimum 229 mm x 305 mm) (Recommended McMaster PN: 86095K43)
    • TDM bonding weights 23 kg (Recommended using two Ruck weights, one 9 kg, one 14 kg) (Alternate using steel shot bags one 9 kg, one 14 kg)
  • Components:

Prerequisite Steps

  • Power off device – Ensure device is powered off and disconnected from a power supply.
  • General Safety – Check to make sure that general guidelines and ESD compliance steps are followed before opening device. Refer to Prior to Device Disassembly for details. for details.
  • Remove TDM – Remove the TDM as detailed in the Procedure - Removal(TDM).

Procedure - Removal (THM)

  1. Disconnect fan from PCBA – Using plastic spudger release the locking bar and slide ZIF connector from the PCBA.

    Screenshot that shows releasing fan ZIF connector locking bar to disconnect fan from PCBA.

  2. THM screw removal – Use a 3IP (Torx plus) driver to remove the 12 THM screws.

    Screenshot that shows twelve THM screw locations prior to removal with a 3IP driver.

  3. Model 1983 WiFi Remove left side speaker tape – Remove tape securing speaker cable to the fan.

    Screenshot that shows removing speaker tape securing cable to fan on Model 1983 WiFi.

  4. Release TIM from PCBA – Using a plastic spudger apply light pressure to the edges of the THM copper shield on the PCBA as pictured. Carefully lift THM from the center copper shield and fan area. Note that shield spring gasket might also come off with the THM copper shield.

    Screenshot that shows lifting THM copper shield from PCBA to release TIM while avoiding gasket damage.

  5. Clean TIM from SoC – Using a plastic spudger, scrape TIM from SoC area. Use IPA and cotton swab to clean SoC of residual TIM.

    Screenshot that shows scraping and cleaning residual TIM from SoC using spudger and IPA.

Procedure - Installation (THM)

  1. Spring gasket placement – If the original gasket appears damaged replace it with a new spring gasket. Ensure the spring gasket is correctly placed over the PCBA then center and align the THM copper shield to the spring gasket.

    Screenshot that shows placing spring gasket over PCBA prior to aligning THM copper shield.

    Screenshot that shows centered THM spring gasket position over PCBA for proper alignment.

  2. Secure copper shield to gasket – Press THM along edges of copper shield cover to snap it in place over the PCBA.

    Screenshot that shows snapping THM copper shield edges into place over spring gasket.

  3. Install new THM screws Model LTE 1982 – Use a 3IP (Torx-Plus) driver to install the 12 screws until snug and seated, and then turn another 45 degrees (1/8 turn) or until screws are fully fastened. Refer to the illustration for screw locations and part numbers. Alternate part numbers in parenthesis.

    Diagram of LTE Model 1982 THM screw locations and part numbers sequence.

  4. Install new THM screws Model WiFi 1983 – Use a 3IP (Torx-Plus) driver to install the 12 screws until snug and seated, and then turn another 45 degrees (1/8 turn) or until screws are fully fastened. Refer to the illustration for screw locations and part numbers. Alternate part numbers in parenthesis.

    Diagram of WiFi Model 1983 THM screw locations and part numbers sequence.

  5. Apply left side fan foams Model LTE 1982 – Install new foam strip as pictured.

    Screenshot that shows installing left side fan foam strip for LTE Model 1982.

  6. Apply left side speaker tape and foams Model WiFi 1983 – Install tape securing speaker cable to the fan. Install new foams as pictured.

    Screenshot that shows applying speaker tape and foams for WiFi Model 1983 on left side.

  7. Connect fan to PCBA – Ensure the fan connector locking tab is up. Slide the fan FPC into the ZIF connector on the PCBA. Press down on the locking tab to secure it.

  8. Install TDM – Install the TDM as detailed in the Procedure – Installation (TDM).

  9. Run SDT – Run SDT to ensure all device features and functions operate as expected.

Preliminary Requirements

Important

Be sure to follow all special (bolded) notes, cautions, & warnings in each process section.

Required Tools and Components

  • Tools:
    • 3IP (Torx-Plus) driver
    • 6IP (Torx-Plus) drive
    • Anti-static wrist strap (1M Ohm resistance)
    • Soft ESD safe mat
    • Microfiber / lint free cloth
    • SIM eject tool (or equivalent 0.023 in / 0.58-mm diameter paperclip)
    • Isopropyl alcohol dispenser bottle (use 91% or greater IPA)
    • Cotton swab
    • USB drive with Surface Diagnostic Toolkit
    • Spudger
    • iFixit opening tool
    • TDM PSA debonding tool (M1214770-001)
    • TDM PSA bonding frame (M1178722-001)
    • Foam Pad (Material: EVA Foam, Thickness: 9.5 mm, Density: 0.03 g/cm3, Minimum 229 mm x 305 mm) (Recommended McMaster PN: 86095K43)
    • TDM bonding weights 23 kg (Recommended using two Ruck weights, one 9 kg, one 14 kg) (Alternate using steel shot bags: one 9 kg, one 14 kg)
  • Components:

Prerequisite Steps

  • Power off device – Ensure device is powered off and disconnected from a power supply.

  • General Safety – Check to make sure that general guidelines and ESD compliance steps are followed before opening device. Refer to Prior to Device Disassembly for details. for details.

  • Remove TDM – Remove the TDM as detailed in the Procedure - Removal(TDM).

  • Remove THM – Remove the THM as detailed in the Procedure - Removal(THM).

  1. Heat spreader tape removal – Remove heat spreader tape covering Surflink. Note tape size isn't the same between WiFi and LTE models. Refer to the illustrations.

    Screenshot that shows removing heat spreader tape covering Surflink on LTE versus WiFi models.

  2. Disconnect FPC from PCBA – Use a spudger to release locking bar and disconnect Surflink connector from PCBA.

    Screenshot that shows releasing Surflink FPC locking bar and disconnecting cable from PCBA.

  3. Screw removal – Use a 6IP (Torx plus) driver to remove the Surflink screws.

    Screenshot that shows removing Surflink screws with a 6IP Torx-Plus driver.

  4. Surflink removal – Remove Surflink from IBC.

    Screenshot that shows lifting Surflink assembly out of IBC after screw removal.

  1. Install new Surflink – Install new Surflink into IBC.

    Screenshot that shows seating new Surflink assembly into IBC recess.

  2. Install screws – Use a 6IP (Torx-Plus) driver to install the Surflink screws until snug and seated, and then turn another 45 degrees (1/8 turn) or until screws are fully fastened. Refer to the illustration for screw locations and part numbers. Alternate part numbers in parenthesis.

    Diagram of Surflink screw installation pattern and part numbers.

  3. Connect FPC to PCBA – Connect Surflink cable to PCBA. Press down on the locking buckle to secure the connector.

    Screenshot that shows connecting Surflink FPC and pressing down locking buckle to secure.

  4. Install new heat spreader tape – Apply new heat spreader tape to the Surflink. Note tape size isn't the same between WiFi and LTE models. Ensure the notched corners are aligned next to the battery. Refer to the illustrations.

    Screenshot that shows applying new heat spreader tape with notched corners aligned near battery.

  5. Install THM – Install the THM as detailed in the Procedure - Installation (THM).

  6. Install TDM – Install the TDM as detailed in the Procedure - Installation (TDM).

  7. Run SDT – Run SDT to ensure all device features and functions operate as expected.