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Warning
Review the General Safety Precautions and Battery Safety guidelines in their entirety before proceeding with any repair steps.
Important
Read this Guide in its entirety before starting any repairs. If at any point you're unsure or uncomfortable about performing the repairs, as detailed in this Guide, DO NOT proceed. Contact Microsoft for more support options.
Warning
Failure to follow the instructions in this Guide, use of non-Microsoft (nongenuine), incompatible, or modified replacement parts, and/or failure to use proper tools could result in serious injury, death, and/or damage to the product or other property.
Prerequisite Steps
Steps outlined in this section should be conducted before starting any repair on a Surface device.
Power off device – Ensure the device is powered off completely and the battery has been fully discharged. Refer to the Repair-specific precautions and warnings section for guidelines. Once discharged, the device should be disconnected from all power sources.
ESD Prevention – Ensure ESD prevention steps and general guidelines are followed before opening the device. Refer to the ESD Prevention section for guidelines.
Position Device – To prevent damage to the device, ensure the device is placed on a clean surface free of debris.
rSSD Replacement Process
Preliminary Requirements
Important
Be sure to follow all special (bolded) notes of caution within each process section.
Required Tools and Components
Tools:
- 3IP (Torx-Plus) driver
- Anti-static wrist strap (1M Ohm resistance)
- Soft ESD safe mat
- Microfiber / Lint free cloth
- SIM ejector tool (or equivalent 0.58 mm / 0.023 in diameter paperclip)
Components:
- rSSD (Refer to Illustrated Service Parts List)
Prerequisite Steps
Power off device – Ensure device is powered off and disconnected from a power supply.
General Safety – Check to make sure that general guidelines and ESD compliance steps are followed before opening device. Refer to Prior to Device Disassembly section for details.
Procedure - Removal (rSSD)
Remove SIM/rSSD door – Use SIM eject tool.
Remove rSSD 3IP Screw – Use a 3IP (Torx-Plus) driver to remove the screw securing the rSSD.
Remove rSSD – The rSSD should lift upwards to ~15-degree tilt after screw is removed. Carefully grab sides of rSSD case and pull out of main board socket at same ~15-degree angle.
Procedure - Installation (rSSD)
Important
Only a Microsoft rSSD of like capacity should be replaced in the device.
Insert rSSD – Insert the connector end of the rSSD into the rSSD connector on Main board at ~15-degree angle.
Install new rSSD 3IP screw – Use a 3IP screwdriver to install a new rSSD screw until the screw is snug and seated, and then turn another 45 degrees (1/8 turn) or until screw is fully fastened.
Replace SIM/rSSD door.
Imaging – Image the new rSSD by using a BMR Imaging USB drive specific to the device model.
Important
Refer to Surface imaging process - Surface Imaging Tools.
- Run SDT – Run SDT to ensure all device features and functions operate as expected.
Swap rSSD to a new device process
Preliminary Requirements
Important
Be sure to follow all special (bolded) notes, cautions, and warnings in each process section. The rSSD 3IP screw is reused in this process. Only a Microsoft rSSD of like capacity should be replaced in the device.
Required Tools and Components
Tools:
- 3IP (Torx-Plus) driver
- Anti-static wrist strap (1M Ohm resistance)
- Soft ESD safe mat
- Microfiber / Lint free cloth
- SIM ejector tool (or equivalent 0.58 mm / 0.023 in diameter paperclip)
- USB Drive
- Surface Dock
- Wired Ethernet connection to the Internet
- USB keyboard
Components:
- New SIM/rSSD door if necessary. (Refer to Illustrated Service Parts List)
Prerequisite Steps:
Using an Internet connection install all available updates: Navigate to Settings-> Update and Security and check for Windows Update.
Consumer using Windows Home:
- The BitLocker recovery key is automatically generated for users with an MSA and can be found by the user by searching the web for “BitLocker recovery key” and logging into their MSA. If the user doesn't have an MSA based account, the disk won't be encrypted.
Commercial using Windows Pro:
- This is managed via commercial policy, and each business might have their own BitLocker policy / recovery method.
- Confirm that the customer knows the Windows password to the device.
General Safety – Check to make sure that general guidelines and ESD compliance steps are followed before opening device. Refer to Prior to Device Disassembly section for details.
Procedure - Swap (rSSD)
Manage Bitlocker
- If rSSD remains encrypted during swap
- Navigate to Bitlocker >Manage Bitlocker >Generate Bitlocker Recovery Key.
- Plug in USB drive.
- Save the recovery key to USB storage.
- Remove the USB drive.
- If rSSD can be unencrypted before swap
- Navigate to Bitlocker >Manage Bitlocker.
- Select Turn Off Bitlocker.
- If rSSD remains encrypted during swap
Shut down customer’s old device and remove SIM/rSSD door on new device – Use SIM eject tool.
Remove SIM (if present in customer’s old device)
Remove rSSD 3IP Screw from both devices – Use a 3IP (Torx-Plus) driver to remove the screw securing the rSSD. Take care not to damage the screw; it will be reused.
Remove rSSD from both devices – The rSSD should lift upwards to ~15-degree tilt after screw is removed. Carefully grab sides of rSSD case and pull out of main board socket at same ~15-degree angle.
rSSD Swap – Insert rSSD removed from the new device into customer’s original device, then insert customer’s original rSSD into new device. Insert the connector end of the rSSD into the rSSD connector on Main board at ~15-degree angle.
Install rSSD 3IP screw in both devices – Use a 3IP screwdriver to install the rSSD screw until it's snug and seated, and then turn another 45 degrees (1/8 turn) or until screw is fully fastened.
Install SIM (if present from the customer’s old device in the new device).
Replace SIM/rSSD door on both devices.
Plug new device into power and wired Internet connection.
Power on new device. The device might go through a firmware update during startup.
If the SSD remained encrypted during the swap:
- Plug in USB drive with BitLocker recovery key.
- Open the .txt file with the BitLocker recovery key.
- Manually enter the recovery key into the new device.
Connect a keyboard to the new device.
Navigate to Sign-In Options->Password (key icon on the left side).
Customer enters Windows password. Select “Sign In”.
Customer might need to go through two-factor authentication.
Once fully signed in, navigate to Start->Account->Sign Out.
Customer signs in with Windows password again.
Customer prompted to setup Windows Hello and PIN.
- If the device was previously Bitlockered, navigate to Bitlocker >Manage Bitlocker >Resume Bitlocker.
Run SDT – Run SDT to ensure all device features and functions operate as expected.
Check Windows activation – Navigate to Settings >Activation. If there's any error message, select Troubleshoot.
Check Office Account – Open Office app and then navigate to File > Account and check for any error messages.
Check cellular (if SIM present) – Unplug device from wired network and disable WiFi. Check that cellular network shows connected, and that the device can open a webpage.
Return customer’s original device per established procedures.
Kickstand Replacement Process
Preliminary Requirements
Important
Be sure to follow all special (bolded) notes of caution within each process section.
Required Tools and Components
Tools:
- 3IP (Torx-Plus) driver
- Loctite SF 7649
- Loctite 243
- Soft ESD safe mat
- Microfiber cloth
Components:
- Kickstand (Refer to Illustrated Service Parts List)
Prerequisite Steps:
- Power off device – Ensure device is powered off and disconnected from a power supply.
- General Safety – Check to make sure that general guidelines and ESD compliance steps are followed before opening device. Refer to Prior to Device Disassembly section for details.
Procedure - Removal (Kickstand)
Place device screen-down on soft ESD-safe mat. Ensure mat is clear of any abrasive material that might scratch the Touch Display Module (TDM) glass.
Extend the kickstand to approximately 90 degrees.
Remove hinge screws – Use your finger to hold the back of the kickstand behind the hinge while fully removing the hinge screws. One screw for each hinge. Ensure screws don't fall into the hinge opening.
Angle Kickstand Down – Firmly grip the hinges and the kickstand between thumb and index fingers. Rotate the kickstand from 90 degrees to approximately 45 degrees.
Release Kickstand Threaded Bosses – Using fingers on the underside of the kickstand and thumb on the topside, slightly rotate the kickstand about the axis as shown below. The kickstand should rotate ~5 degrees to free the two threaded bosses of the kickstand from the recesses of the hinges.
Remove Kickstand – Using the palm of your hand, firmly hold the device down from the center of the IBC. Simultaneously, grip the kickstand off-center between your thumb and index finger and firmly pull. Pull with a moderate amount of force until the foam inserts slide out of the device. If the kickstand is stuck, ensure the threaded bosses have not slipped back into the recess on the hinges.
Warning
Inspect Removed Kickstand Foam Tabs – Damaged foam or tabs can't be safely removed. Attempts to do so can damage internal components. Don't insert anything other than the tabs into the slots. Ensure both tabs are complete and show no signs of tearing. If tabs show signs of tearing, part of the foam might still be inside the device. Before proceeding, all foam must be removed from the device. Foam left inside warrants whole unit exchange.
Procedure - Installation (Kickstand)
Important
Use caution when handling new kickstand assembly to avoid cosmetic damage of the kickstand and the device.
- Insert Foam Tabs – With the hinges still at ~45 degrees start to slide the new kickstand’s foam tabs into the slots on the back of the IBC. Foam should slide in with minimal force—don't crumple the foam by using excess force. Don't slide the foams completely into the device—insert the foam tabs until ~3/4 of the foam tabs are inside the device.
Caution
Don't use any tool or sharp object to assist inserting the tabs into the slots. Only the tabs should be inserted. Doing so could damage internal components.
Slot Outer Lip of Hinge into Kickstand – Using fingers on the underside of the kickstand and thumb on the topside, slightly rotate the kickstand about the axis as shown below. The kickstand should rotate ~5 degrees to catch the outer lip of the hinge. Push the kickstand toward the device.
Slip Kickstand Threaded Bosses into Hinge Recesses – Maintaining pressure on the kickstand to prevent it from backing out, rotate the kickstand down into place. The threaded bosses of the kickstand should slip into the recesses of the hinges.
Rotate the Kickstand Up – Firmly grip the hinges and the kickstand between thumb and index fingers as shown below. Rotate the kickstand from 45 degrees to approximately 90 degrees.
Apply thread locker to screws – Brush new screws with Loctite SF 7649 Activator. Let screws sit for 2 minutes after activator is applied before assembling to device.
Apply thread locker to screws bosses – Apply one drop of Loctite 243 thread locker to each screw boss.
Install hinge screws – Use your finger to hold the back of the kickstand behind the hinge while installing the screws until they're fully seated. Ensure the kickstand is properly aligned and seated in the hinges, then tighten the screws an more ~quarter turn (~90 degrees). Be careful to tighten the screws only until snug and not to strip the kickstand threads. Ensure screws don't fall into hinge opening.
Final inspection Kickstand installation – Fold the kickstand down and peel off protective plastic from the kickstand and logo if present. Verify the side edges of the kickstand are aligned with the midframe walls and that there are no obvious steps/gaps between the kickstand and the IBC. Wipe the device thoroughly (including under the kickstand) with the microfiber cloth to remove all fingerprints.
TDM Replacement Process
Preliminary Requirements
Important
Be sure to follow all special (bolded) notes, cautions, and warnings in each process section.
Required Tools and Components
Tools:
- 3IP (Torx-Plus) driver
- Anti-static wrist strap (1M Ohm resistance)
- Soft ESD safe mat
- Microfiber / lint free cloth
- SIM eject tool (or equivalent 0.58 mm / 0.023 in diameter paperclip)
- Isopropyl alcohol dispenser bottle (use 91% or greater IPA)
- Cotton swab
- USB drive with Surface Diagnostic Toolkit
- Spudger
- iFixit pick
- iFixit opening tool
- Metric ruler
- TDM PSA bonding frame
- Foam Pad (Material: EVA Foam, Thickness: 9.5 mm, Density: 0.03 g/cm3, Minimum 229 mm x 305 mm) (Recommended McMaster PN: 86095K43)
- TDM bonding weights minimum 23 kg (50 lb) / maximum 26 kg (57 lb) (Recommended using two Ruck weights one 9 kg, one 14 kg) (Alternate using steel shot bags one 9 kg, one 14 kg)
Components:
- TDM (Refer to Illustrated Service Parts List)
Prerequisite Steps:
- Prep Device – Device must be set in TDM Replacement Mode before removing TDM.
- Connect software tools USB drive with SDT to USB connector on device under repair.
- Connect power supply to device.
- Power on device – Depress the power button on the side of the device.
- Run software tool – At the device OS, use Windows Explorer, navigate to USB drive and run: SDT – Select Repair setup and validation. Run the Touch Display Setup. At the end of the tool process device powers down.
Warning
This step must be carried out on the device successfully before the TDM is replaced.
- Power off device – Ensure device is powered off and disconnected from a power supply. Remove all attached cables and drives.
- General Safety – Check to make sure that general guidelines and ESD compliance steps are followed before opening device. Refer to Prior to Device Disassembly for details.
- Remove rSSD – Remove the rSSD as detailed in the Procedure – Removal (rSSD).
Procedure - Removal (TDM)
Speaker Mesh Preparation – Place the device face up on a Soft ESD safe mat. Use an iFixit opening tool to widen the gap between the right speaker mesh and device. Push the sharp edge into the gap and side to side along the device edge. Once the flat tip fits fully in the gap, use it to push the speaker mesh towards the device, repeating uniformly along the length of the speaker mesh. The metal mesh will either fold lengthwise or slide completely under the glass. Repeat this process for left speaker mesh.
Debonding TDM Marking Pick Depth – Using a metric ruler draw a 3mm mark and 10-mm mark on the iFixit pick.
Debonding TDM – Replace the iFixit pick if all the tips look scratched or deformed. Securing the device with one hand insert one of the iFixit pick tips into the right speaker mesh area. Carefully cut the PSA, applying a steady force along all edges of the TDM. Use the 3mm marking as a guide to avoid cutting too deep along the sides and bottom of the TDM. Use the 10mm marking as a guide to avoid cutting too deep along the top of the TDM.
Caution
Don't insert the pick more than 3mm along the left and right sides or bottom edge of the TDM. The TDM has three FPCs along the bottom edge that might get damaged. Refer to the yellow boxes in the following cut path diagram. The pick depth shouldn't exceed 10mm along the top edge of the TDM.
Separate TDM From IBC – Place the device face up on a Soft ESD safe mat. Gently pull up vertically on the top edge of the glass while pushing down on the IBC with your thumbs to separate the glass. Lift the edges of the TDM and inspect for any remaining PSA. Slice or remove (with an iFixit Pick) any strands still connecting the TDM to the IBC.
Disconnect TDM FPC – Place the TDM face down on top of the device. Remove the shield lid on the TDM FPC by inserting tweezers underneath the taps at the front of the shield (circled). Then gently pull upwards and the shield will come off. Disconnect the TDM FPC using the pointed end of a spudger. Don't pull on the FPC to disconnect.
Remove Speaker Mesh from IBC – Remove any remaining speaker mesh from the IBC. Use a handheld pick to remove it by inserting the pick between the Speaker mesh and the enclosure. Confirm a successful removal of the speaker mesh and its adhesive by verifying the three cutouts of the IBC are exposed, as shown below.
Remove Residual IBC PSA – Using IPA and cotton swabs clean residual PSA off the IBC. Ensure area around the Camera and IR Sensor is clean and free of any dust or other contamination. Wipe the area around the camera with a lint free cloth.
Procedure - Installation (TDM)
- Pre-installation Device Inspection
Warning
Verify the battery’s condition refer to the M1153910 In Device Battery Inspection process. Devices exhibiting battery issues as outlined in the Battery Inspection Process require whole unit replacement.
Important
Remove Leave protective cling on new TDM during all installation steps.
Important
Carefully inspect the internal areas of the bucket. Ensure the area around battery is free of any foreign objects..
TDM PSA Application – Thoroughly clean the IBC along the TDM PSA bonding surface using IPA and a cotton swab. Wait at least 30 seconds before applying new PSA. Apply the 4 strips of PSA to the IBC. Align the PSA following the outline on the IBC. Leave the blue liner on the PSA, it will be removed at a later step. Refer to the below illustration for PSA locations.
Speaker Mesh Application – Place the new TDM face-down on a Soft ESD safe mat. Wipe down the outer edges of the TDM with a lint free cloth. Remove the protective liner from the speaker mesh. Using the clear handle, align the speaker mesh into the TDM speaker opening. Press onto the mesh for 10 seconds to activate the adhesive. Carefully remove the clear handle. Repeat this process for the other side of the TDM.
Connect TDM FPC – Place the TDM face down on top of the device. Slide the FPC into the TDM connector. Install a new shield on the TDM FPC connection. Ensure all edges of the shield are pressed down over the connector.
Apply TDM to Bucket – Hover the TDM and remove the PSA Liners to expose adhesive. Turn over the TDM and place it on the IBC. Align the TDM along the top edge first (Toe-in) and lower after alignment is found. Ensure that the glass sits flush in the IBC and doesn't rest anywhere on top of the IBC lip.
Bonding PSA – Place the bonding frame on the device, ensuring that the cutouts on the sides line up with the volume/power buttons. Place foam pad over bonding frame. Place the 23 kg of weight on top of the foam pad and bonding fame. Leave weight in place for 1 minute.
Important
Weight Requirement: Minimum 23 kg (50 lb) / Maximum 26 kg (57 lb) Minimum Dimensions: 280mm x 200mm
Geometry must be symmetrical, to allow for even weight distribution. Weight used must be a flat plate, with consistent flatness and not protrude from contact plane with Bonding Frame.
Weight must contact the full perimeter of the frame when placed above it. Recommended weights (Ruck Plates of 9 kg + 14 kg)
When using Ruck weights place the 14-kg weight first, then stack the 9-kg weight on top. Ensure foam pad covers entire bonding frame.
After Bonding Inspection – Remove the weights, foam pad, and the frame. Lift carefully to avoid damaging the device. Inspect the TDM for scratches, cracks, large gaps, and its flushness with respect to the IBC.
Install rSSD – Install the rSSD as detailed in the Procedure – Installation (rSSD)
TDM Calibration – Device final calibration relies on the successful completion of the TDM Replacement Mode.
- Connect software tools USB drive with SDT to USB connector on device under repair.
- Power on device – Depress the power button on the side of the device.
- Run software tool – At the device OS, use Windows Explorer, navigate to USB drive and run: SDT – Select Repair setup and validation. Run the Touch Display Calibration. Accept the restart prompt at the end of the tool process.
Warning
This step must be carried out on the device successfully. Any tool failures require restarting the TDM replacement process with a new FRU.
- Run SDT – Run all SDT tests to ensure all device features and functions operate as expected.
- Final inspection TDM installation – Remove protective cling from the TDM. Verify the side edges of the TDM are flush, and that there are no obvious steps/gaps between the TDM and the IBC. Wipe the device thoroughly (including under the kickstand) with the microfiber cloth to remove all fingerprints.
Procedure - Alternate Installation (TDM)
- Pre-installation Device Inspection
Warning
Verify the battery’s condition refer to the M1153910 In Device Battery Inspection process. Devices exhibiting battery issues as outlined in the Battery Inspection Process require whole unit replacement.
Important
Leave protective cling on new TDM during all installation steps.
Important
Carefully inspect the internal areas of the bucket. Ensure the area around battery is free of any foreign objects.
TDM PSA Application – Thoroughly clean the IBC along the TDM PSA bonding surface using IPA and a cotton swab. Wait at least 30 seconds before applying new PSA. Apply the 4 strips of PSA to the IBC. Align the PSA following the outline on the IBC. Leave the blue liner on the PSA, it will be removed at a later step. Refer to the below illustration for PSA locations.
Speaker Mesh Application – Place the new TDM face-down on a Soft ESD safe mat. Wipe down the outer edges of the TDM with a lint free cloth. Remove the protective liner from the speaker mesh. Using the clear handle, align the speaker mesh into the TDM speaker opening. Press onto the mesh for 10 seconds to activate the adhesive. Carefully remove the clear handle. Repeat this process for the other side of the TDM.
Connect TDM FPC – Place the TDM face down on top of the device. Slide the FPC into the TDM connector. Install a new shield on the TDM FPC connection. Ensure all edges of the shield are pressed down over the connector.
Apply TDM to Bucket – Hover the TDM and remove the PSA Liners to expose adhesive. Turn over the TDM and place it on the IBC. Align the TDM along the top edge first (Toe-in) and lower after alignment is found. Ensure that the glass sits flush in the IBC and doesn't rest anywhere on top of the IBC lip. Lightly press on the edges of the TDM to create an initial bond.
Alternate Bonding PSA – Bonding is a multi-step process. Refer to the below illustrations.
Important
Use steel shot bags one 9 kg and one 14 kg. Apply the 9-kg bag, and then the 14-kg bag.
After Bonding Inspection – Remove the steel shot bags and lift device out of the frame. Lift carefully to avoid damaging the device. Inspect the TDM for scratches, cracks, large gaps, and its flushness with respect to the IBC.
Install rSSD – Install the rSSD as detailed in the Procedure – Installation (rSSD)
TDM Calibration – Device final calibration relies on the successful completion of the TDM Replacement Mode.
- Connect software tools USB drive with SDT to USB connector on device under repair.
- Power on device – Depress the power button on the side of the device.
- Run software tool – At the device OS, use Windows Explorer, navigate to USB drive and run: SDT – Select Repair setup and validation. Run the Touch Display Calibration. Accept the restart prompt at the end of the tool process.
Warning
This step must be carried out on the device successfully. Any tool failures require restarting the TDM replacement process with a new FRU.
Run SDT – Run all SDT tests to ensure all device features and functions operate as expected.
Final inspection TDM installation – Remove protective cling from the TDM. Verify the side edges of the TDM are flush, and that there are no obvious steps/gaps between the TDM and the IBC. Wipe the device thoroughly (including under the kickstand) with the microfiber cloth to remove all fingerprints.